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| INTEGRATED CIRCUITS DATA SHEET 74AHC123A; 74AHCT123A Dual retriggerable monostable multivibrator with reset Product specification File under Integrated Circuits, IC06 2000 Mar 15 Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset FEATURES * ESD protection: HBM EIA/JESD22-A114-A exceeds 2000 V MM EIA/JESD22-A115-A exceeds 200 V CDM EIA/JESD22-C101 exceeds 1000 V * All inputs have Schmitt-trigger actions * Inputs accept voltages higher than VCC * For AHC only: operates with CMOS input levels * For AHCT only: operates with TTL input levels * Specified from -40 to +85 C and -40 to +125 C * DC triggered from active HIGH or active LOW inputs * Retriggerable for very long pulses up to 100% duty factor * Direct reset terminates output pulse * Output capability: standard (except for nREXT/CEXT). DESCRIPTION The 74AHC/AHCT123A are high-speed Si-gate CMOS devices and are pin compatible with Low power Schottky TTL (LSTTL). They are specified in compliance with JEDEC standard no.7A. The 74AHC/AHCT123A are dual retriggerable monostable multivibrators with output pulse width control by three methods. The basic pulse time is programmed by selection of an external resistor (REXT) and capacitor (CEXT). The external resistor and capacitor are normally connected as shown in Fig.6. 74AHC123A; 74AHCT123A Once triggered, the basic output pulse width may be extended by retriggering the gated active LOW-going edge input (nA) or the active HIGH-going edge input (nB). By repeating this process, the output pulse period (nQ = HIGH, nQ = LOW) can be made as long as desired. Alternatively an output delay can be terminated at any time by a LOW-going edge on input nRD, which also inhibits the triggering. An internal connection from nRD to the input gate makes it possible to trigger the circuit by a positive-going signal at input nRD as shown in the function table. Figs 8 and 9 illustrate pulse control by retriggering and early reset. The basic output pulse width is essentially determined by the value of the external timing components REXT and CEXT. When CEXT 10 nF, the typical output pulse width is defined as: tW = REXT x CEXT where tW = pulse width in ns; REXT = external resistor in k; CEXT = external capacitor in pF. Schmitt-trigger action at all inputs makes the circuit highly tolerant to slower input rise and fall times. The `123' is identical to the `423' but can be triggered via the reset input. 2000 Mar 15 2 Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset QUICK REFERENCE DATA GND = 0 V; Tamb = 25 C; tr = tf 3.0 ns. 74AHC123A; 74AHCT123A TYPICAL SYMBOL tPHL/tPLH PARAMETER propagation delay nA, nB to nQ, nQ nRD to nQ, nQ CI CO CPD Notes 1. CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD x VCC2 x fi + (CL x VCC2 x fo) x CEXT x VCC2 x fo + D x 16 x VCC where: fi = input frequency in MHz; fo = output frequency in MHz; (CL x VCC2 x fo) = sum of outputs; D = duty factor in %; CL = output load capacitance in pF; CEXT = timing capacitance in pF; VCC = supply voltage in Volts. 2. The condition is VI = GND to VCC. input capacitance output capacitance power dissipation capacitance CL = 50 pF; f = 1 MHz; notes 1 and 2 VI = VCC or GND CONDITIONS AHC CL = 15 pF; VCC = 5 V; REXT = 5 k; CEXT = 0 pF 5.1 5.6 5 4 57 AHCT 5.0 5.2 3 4 58 ns ns pF pF pF UNIT 2000 Mar 15 3 Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset FUNCTION TABLE See note 1. INPUTS nRD L X X H H Notes 1 H = HIGH voltage level; L = LOW voltage level; X = don't care; = LOW-to-HIGH CP transition; = HIGH-to-LOW CP transition. 2 3 4 nA X H X L L nB X X L H H nQ L L(2) L(2) (3) (3) (3) 74AHC123A; 74AHCT123A OUTPUTS nQ H H(2) H(2) (4) (4) (4) If the monostable multivibrator was triggered before this condition was established, the pulse will be continued as programmed. One HIGH-level output pulse. One LOW-level output pulse. ORDERING INFORMATION PACKAGES TYPE NUMBER 74AHC123AD 74AHC123APW 74AHCT123AD 74AHCT123APW TEMPERATURE RANGE -40 to +125 C PINS 16 16 16 16 PACKAGE SO TSSOP SO TSSOP MATERIAL plastic plastic plastic plastic CODE SOT109-1 SOT403-1 SOT109-1 SOT403-1 2000 Mar 15 4 Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset PINNING PIN 1, 9 2, 10 3, 11 4, 12 5, 13 6, 14 7, 15 8 16 1A, 2A 1B, 2B 1RD, 2RD 1Q, 2Q 2Q, 1Q 2CEXT, 1CEXT 2REXT/CEXT, 1REXT/CEXT GND VCC SYMBOL 74AHC123A; 74AHCT123A DESCRIPTION trigger inputs (negative-edge triggered) trigger inputs (positive-edge triggered) direct reset LOW and trigger action at positive edge outputs (active LOW) outputs (active HIGH) external capacitor connection external resistor/capacitor connection ground (0 V) DC supply voltage handbook, halfpage handbook, halfpage 1A 1 1B 2 1RD 3 1Q 4 16 VCC 15 1REXT/CEXT 14 1CEXT 13 1Q S 1 1A 9 2A T Q RD Q 1CEXT 14 2CEXT 6 1REXT/CEXT 15 2REXT/CEXT 7 1Q 13 2Q 5 1Q 4 123 2Q 5 2CEXT 6 2REXT/CEXT 7 GND 8 MNA514 12 2Q 11 2RD 10 2B 9 2A 2 1B 10 2B 3 1RD 11 2RD 2Q 12 MNA515 Fig.1 Pin configuration. Fig.2 Logic diagram. 2000 Mar 15 5 Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset 74AHC123A; 74AHCT123A handbook, halfpage 14 15 1 2 CX RCX & 4 13 handbook, halfpage 1CEXT 14 2CEXT 6 1REXT/CEXT 15 2REXT/CEXT 7 S 1 1A Q T Q RD 1Q 4 2Q 12 1Q 13 2Q 5 3 R 6 7 9 10 CX RCX & 12 5 9 2A 2 1B 10 2B 3 1RD 11 2RD 11 R MNA516 MNA517 Fig.3 IEC logic symbol. Fig.4 Functional diagram. 2000 Mar 15 6 Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset 74AHC123A; 74AHCT123A handbook, full pagewidth nREXT/CEXT VCC RD R CL R CL Q Q VCC VCC R CL MNA518 A CL CL B R For minimum noise generation, it is recommended to ground pins 6 (2CEXT) and 14 (1CEXT) externally to pin 8 (GND). Fig.5 Logic diagram (one flip-flop). 2000 Mar 15 7 Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset 74AHC123A; 74AHCT123A handbook, halfpage VCC REXT CEXT to nCEXT (pin 14 or 6) to nREXT/CEXT (pin 15 or 7) MNA519 Fig.6 Timing component connections. RECOMMENDED OPERATING CONDITIONS 74AHC SYMBOL VCC VI VO Tamb tr, tf REXT CEXT PARAMETER DC supply voltage input voltage output voltage operating ambient temperature input rise and fall time ratios external timing resistor external timing capacitor see DC and AC characteristics per device VCC = 3.3 0.3 V VCC = 5 0.5 V VCC = 2 V VCC > 3 V CONDITIONS MIN. 2.0 0 0 -40 -40 - - 5 1 TYP. 5.0 - - +25 +25 - - - - MAX. 5.5 5.5 VCC +85 +125 100 20 - - MIN. 4.5 0 0 -40 -40 - - 5 1 no limits TYP. 5.0 - - +25 +25 - - - - MAX. 5.5 5.5 VCC +85 +125 - 20 - - V V V C C ns/V ns/V k k pF 74AHCT UNIT 2000 Mar 15 8 Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset 74AHC123A; 74AHCT123A LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V). SYMBOL VCC VI IIK IOK IO ICC Tstg PD Notes 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. For SO packages: above 70 C the value of PD derates linearly with 8 mW/K. For TSSOP packages: above 60 C the value of PD derates linearly with 5.5 mW/K. input voltage DC input diode current DC output clamping diode current DC output sink current DC VCC or GND current storage temperature power dissipation per package for temperature range: -40 to +125 C; note 2 VI < -0.5 V; note 1 VO < -0.5 V or VO > VCC + 0.5 V; note 1 -0.5 V < VO < VCC + 0.5 V PARAMETER DC supply voltage CONDITIONS MIN. -0.5 -0.5 - - - - -65 - MAX. +7.0 +7.0 -20 20 25 75 +150 500 UNIT V V mA mA mA mA C mW 2000 Mar 15 9 Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset DC CHARACTERISTICS Family 74AHC Over recommended operating conditions; voltages are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER OTHER VIH HIGH-level input voltage VCC (V) 2.0 3.0 5.5 VIL LOW-level input voltage 2.0 3.0 5.5 VOH HIGH-level output VI = VIH or VIL; voltage IO = -50 A VI = VIH or VIL; IO = -4.0 mA VI = VIH or VIL; IO = -8.0 mA VOL LOW-level output voltage VI = VIH or VIL; IO = 50 A VI = VIH or VIL; IO = 4.0 mA VI = VIH or VIL; IO = 8.0 mA II input leakage current; REXT/CEXT input leakage current; nA, nB, nRD ICC quiescent supply current quiescent supply current active state (per circuit) CI Note 1. Voltage on pin nREXT/CEXT = 0.5 x VCC and pin REXT/CEXT in OFF-state during test. input capacitance VI = VCC or GND; note 1 VI = VCC or GND 2.0 3.0 4.5 3.0 4.5 2.0 3.0 4.5 3.0 4.5 5.5 MIN. 1.5 2.1 3.85 - - - 1.9 2.9 4.4 2.58 3.94 - - - - - - - - - - - - 2.0 3.0 4.5 - - 0 0 0 - - - 25 - - - 0.5 0.9 1.65 - - - - - 0.1 0.1 0.1 0.36 0.36 Tamb (C) -40 to +85 - - - 0.5 0.9 1.65 - - - - - 0.1 0.1 0.1 0.44 0.44 2.5 74AHC123A; 74AHCT123A -40 to +125 - - - 0.5 0.9 1.65 - - - - - 0.1 0.1 0.1 0.55 0.55 UNIT TYP. MAX. MIN. MAX. MIN. MAX. 1.5 2.1 3.85 - - - 1.9 2.9 4.4 2.48 3.8 - - - - - 1.5 2.1 3.85 - - - 1.9 2.9 4.4 2.40 3.70 - - - - - - V V V V V V V V V V V V V V V V 0.25 - 10.0 A 5.5 - - 0.1 - 1.0 - 2.0 A VI = VCC or GND; IO = 0 VI = VCC or GND; note 1 5.5 3 4.5 5.5 - - - - - - - 160 380 560 5 4.0 250 500 750 10 - - - - - 40 280 650 975 10 - - - - - 80 280 650 975 10 A A A A pF 2000 Mar 15 10 Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset Family 74AHCT Over recommended operating conditions; voltage are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER OTHER VIH VIL VOH HIGH-level input voltage LOW-level input voltage HIGH-level output VI = VIH or VIL; voltage IO = -50 A VI = VIH or VIL; IO = -8.0 mA VOL LOW-level output voltage VI = VIH or VIL; IO = 50 A VI = VIH or VIL; IO = 8.0 mA II input leakage current; REXT/CEXT input leakage current; nA, nB, nRD ICC quiescent supply current quiescent supply current active state (per circuit) CI Note 1. Voltage on pin nREXT/CEXT = 0.5 x VCC and pin REXT/CEXT in OFF-state during test. input capacitance VCC (V) MIN. - - 4.5 - 0 - - 25 - 0.8 - - 0.1 0.36 Tamb (C) -40 to +85 - 0.8 - - 0.1 0.44 2.5 74AHC123A; 74AHCT123A -40 to +125 - 0.8 - - 0.1 0.55 UNIT TYP. MAX. MIN. MAX. MIN. MAX. 2.0 - 4.4 3.8 - - 2.0 - 4.4 3.70 - - - V V V V V V 4.5 to 5.5 2.0 4.5 to 5.5 - 4.5 4.5 4.5 4.5 4.4 3.94 - - - VI = VCC 5.5 or GND; note 1 VI = VCC or GND VI = VCC or GND; IO = 0 5.5 0.25 - 10.0 A - - 0.1 - 1.0 - 2.0 A 5.5 - - - - - 380 560 3 4.0 500 750 10 - - - - 40 650 975 10 - - - - 80 650 975 10 A A A pF VI = VCC 4.5 or GND; note 1 5.5 - 2000 Mar 15 11 Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset AC CHARACTERISTICS Type 74AHC123A GND = 0 V; tr = tf 3.0 ns. TEST CONDITIONS SYMBOL PARAMETER WAVEFORMS VCC = 3.0 to 3.6 V; note 1 tPHL/tPLH propagation delay; CEXT = 0 pF; nA, nB to nQ, nQ REXT = 5 k; see Figs 7 and 11 propagation delay; CEXT = 0 pF; nRD to nQ, nQ REXT = 5 k; see Figs 7 and 11 propagation delay; CEXT = 0 pF; nRD to nQ, nQ REXT = 5 k; (reset) see Figs 7 and 11 propagation delay; CEXT = 0 pF; nA, nB to nQ , nQ REXT = 5 k; see Figs 7 and 11 propagation delay; CEXT = 0 pF; nRD to nQ, nQ REXT = 5 k; see Figs 7 and 11 propagation delay; CEXT = 0 pF; nRD to nQ, nQ REXT = 5 k; (reset) see Figs 7 and 11 tW trigger pulse width; nA = LOW trigger pulse width; nB = HIGH reset pulse width; nRD = LOW see Fig 8 see Fig 8 see Fig 9 15 pF - 7.4 20.6 1.0 24.0 CL 25 Tamb (C) 74AHC123A; 74AHCT123A -40 to +85 -40 to +125 UNIT MIN. TYP. MAX. MIN. MAX. MIN. MAX. 1.0 26.0 ns - 8.2 22.4 1.0 26.0 1.0 26.0 ns - 6.4 15.8 1.0 18.5 1.0 20.0 ns 50 pF - 10.5 24.1 1.0 27.5 1.0 30.0 ns - 11.7 25.9 1.0 29.5 1.0 32.0 ns - 9.2 19.3 1.0 22.0 1.0 24.5 ns 5.0 5.0 5.0 - - - - 115 - - - 240 5.0 5.0 5.0 - - - - 300 5.0 5.0 5.0 - - - - 300 ns ns ns ns CEXT = 28 pF; output pulse width; nQ = HIGH; REXT = 2 k; note 3; see Figs 8, nQ = LOW 9 and 10 CEXT = 0.01 F; REXT = 10 k; note 3; see Figs 8, 9 and 10 CEXT = 0.1 F; REXT = 10 k; note 3; see Figs 8, 9 and 10 90 100 110 90 110 85 115 s 0.9 1 1.1 0.9 1.1 0.85 1.15 ms 2000 Mar 15 12 Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset TEST CONDITIONS SYMBOL PARAMETER WAVEFORMS VCC = 3.0 to 3.6 V; note 1 trt retrigger time; nA to nB CEXT = 100 pF; REXT = 1 k; see Figs 8, 9 and 10 CEXT = 0.01 F; REXT = 1 k; see Figs 8, 9 and 10 VCC = 4.5 to 5.5 V; note 2 tPHL/tPLH propagation delay; CEXT = 0 pF; nA, nB to nQ, nQ REXT = 5 k; see Figs 7 and 11 propagation delay; CEXT = 0 pF; nRD to nQ, nQ REXT = 5 k; see Figs 7 and 11 propagation delay; CEXT = 0 pF; nRD to nQ, nQ REXT = 5 k; (reset) see Figs 7 and 11 propagation delay; CEXT = 0 pF; nA, nB to nQ, nQ REXT = 5 k; see Figs 7 and 11 propagation delay; CEXT = 0 pF; nRD to nQ, nQ REXT = 5 k; see Figs 7 and 11 propagation delay; CEXT = 0 pF; nRD to nQ, nQ REXT = 5 k; (reset) see Figs 7 and 11 15 pF - 5.1 12 1.0 14.0 50 pF - 60 - - - CL 25 Tamb (C) 74AHC123A; 74AHCT123A -40 to +85 -40 to +125 UNIT MIN. TYP. MAX. MIN. MAX. MIN. MAX. - - ns - 1.5 - - - - - s 1.0 15.5 ns - 5.6 12.9 1.0 15.0 1.0 16.5 ns - 4.4 9.4 1.0 11.0 1.0 12.0 ns 50 pF - 7.3 14 1.0 16.0 1.0 17.5 ns - 8.1 14.9 1.0 17.0 1.0 19.0 ns - 6.3 11.4 1.0 13.0 1.0 14.5 ns 2000 Mar 15 13 Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset TEST CONDITIONS SYMBOL PARAMETER WAVEFORMS VCC = 4.5 to 5.5 V; note 2 tW trigger pulse width; nA = LOW trigger pulse width; nB = HIGH reset pulse width; nRD = LOW see Fig 8 see Fig 8 see Fig 9 50 pF 5.0 5.0 5.0 - - - - 100 - - - 200 5.0 5.0 5.0 - - - - 240 CL 25 Tamb (C) 74AHC123A; 74AHCT123A -40 to +85 -40 to +125 UNIT MIN. TYP. MAX. MIN. MAX. MIN. MAX. - - - 240 5.0 5.0 5.0 - ns ns ns ns output pulse CEXT = 28 pF; width; nQ = HIGH; REXT = 2 k; nQ = LOW note 3; see Figs 8, 9 and 10 CEXT = 0.01 F; REXT = 10 k; note 3; see Figs 8, 9 and 10 CEXT = 0.1 F; REXT = 10 k; note 3; see Figs 8, 9 and 10 trt retrigger time; nA to nB CEXT = 100 pF; REXT = 1 k; see Figs 8, 9 and 10 CEXT = 0.01 F; REXT = 1 k; see Figs 8, 9 and 10 Notes 90 100 110 90 110 85 115 s 0.9 1 1.1 0.9 1.1 0.85 1.15 ms - 39 - - - - - ns - 1.2 - - - - - s 1. Typical values are measured at VCC = 3.3 V and Tamb = 25 C. 2. Typical values are measured at VCC = 5.0 V and Tamb = 25 C. 3. For CEXT 10 nF the typical value of the pulse width tW (s) = REXT (k) x CEXT (nF). 2000 Mar 15 14 Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset Type 74AHCT123A GND = 0 V; tr = tf 3.0 ns. TEST CONDITIONS SYMBOL PARAMETER WAVEFORMS VCC = 4.5 to 5.5 V; note 1 tPHL/tPLH propagation delay; CEXT = 0 pF; nA, nB to nQ, nQ REXT = 5 k; see Figs 7 and 11 propagation delay; CEXT = 0 pF; nRD to nQ, nQ REXT = 5 k; see Figs 7 and 11 propagation delay; CEXT = 0 pF; REXT = 5 k; see nRD to nQ, nQ (reset) Figs 7 and 11 propagation delay; CEXT = 0 pF; nA, nB to nQ, nQ REXT = 5 k; see Figs 7 and 11 propagation delay; CEXT = 0 pF; nRD to nQ, nQ REXT = 5 k; see Figs 7 and 11 propagation delay; CEXT = 0 pF; nRD to nQ, nQ REXT = 5 k; see (reset) Figs 7 and 11 tW trigger pulse width; nA = LOW trigger pulse width; nB = HIGH reset pulse width; nRD = LOW see Fig 8 see Fig 8 see Fig 9 15 pF - 5.0 12 1.0 14 CL 25 Tamb (C) 74AHC123A; 74AHCT123A -40 to +85 -40 to +125 UNIT MIN. TYP. MAX. MIN. MAX. MIN. MAX. 1.0 15.5 ns - 5.2 12.9 1.0 15.0 1.0 16.5 ns - 4.7 9.4 1.0 11 1.0 12.0 ns 50 pF - 7.1 14 1.0 16 1.0 17.5 ns - 7.5 14.9 1.0 17.0 1.0 18.5 ns - 6.7 11.4 1.0 13 1.0 14.5 ns 50 pF 5.0 5.0 5.0 - - - - 100 - - - 200 5.0 5.0 5.0 - - - - 240 5.0 5.0 5.0 - - - - 240 ns ns ns ns output pulse width; CEXT = 28 pF; nQ = HIGH; REXT = 2 k; note 2; nQ = LOW see Figs 8, 9 and 10 CEXT = 0.01 F; REXT = 10 k; note 2; see Figs 8, 9 and 10 CEXT = 0.1 F; REXT = 10 k; note 2; see Figs 8, 9 and 10 90 100 110 90 110 85 115 s 0.9 1 1.1 0.9 1.1 0.85 1.15 ms 2000 Mar 15 15 Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset TEST CONDITIONS SYMBOL PARAMETER WAVEFORMS VCC = 4.5 to 5.5 V; note 1 trt retrigger time; nA to nB CEXT = 100 pF; REXT = 1 k; see Figs 8, 9 and 10 CEXT = 0.01 F; REXT = 1 k; see Figs 8, 9 and 10 Notes 1. Typical values are measured at VCC = 5.0 V and Tamb = 25 C. 2. For CEXT 10 nF the typical value of the pulse width tW (s) = REXT (k) x CEXT (nF). 50 pF - 60 - - - CL 25 Tamb (C) 74AHC123A; 74AHCT123A -40 to +85 -40 to +125 UNIT MIN. TYP. MAX. MIN. MAX. MIN. MAX. - - ns - 1.5 - - - - - s 2000 Mar 15 16 Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset AC WAVEFORMS 74AHC123A; 74AHCT123A handbook, full pagewidth nA input VM(1) VM(1) tW nB input VM(1) tW nRD input t rt t PLH VM(1) tW nQ output VM(2) t PHL tW tW t PLH nQ output VM(2) t W + t rt t PHL t PLH t PHL MNA520 FAMILY AHC AHCT Fig.7 VI INPUT REQUIREMENTS GND to VCC GND to 3.0 V VM (1) INPUT 50% VCC 1.5 V VM (2) OUTPUT 50% VCC 50% VCC Input (nA, nB, nRD) to output (nQ, nQ) propagation delays, the input and output pulse widths and the input retrigger time. 2000 Mar 15 17 Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset 74AHC123A; 74AHCT123A handbook, full pagewidth nB input tW nA input t rt nQ output tW tW tW tW MNA521 Fig.8 Output pulse control using retrigger pulse; nRD = HIGH. handbook, full pagewidth nB input nRD input tW nQ output tW tW MNA522 Fig.9 Output pulse control using reset input nRD; nA = LOW. 2000 Mar 15 18 Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset 74AHC123A; 74AHCT123A handbook, full pagewidth t rt nA input nB input nRD input nREXT/CEXT nQ output nQ output tW tW t W + t rt MNA523 Fig.10 Input and output timing. handbook, full pagewidth S1 VCC PULSE GENERATOR VI D.U.T. RT CL MNA183 VO 1000 VCC open GND TEST tPLH/tPHL tPLZ/tPZL tPHZ/tPZH open VCC GND S1 Definitions for test circuit. CL = load capacitance including jig and probe capacitance (See Chapter "AC characteristics"). RT = termination resistance should be equal to the output impedance Zo of the pulse generator. Fig.11 Load circuitry for switching times. 2000 Mar 15 19 Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset PACKAGE OUTLINES SO16: plastic small outline package; 16 leads; body width 3.9 mm 74AHC123A; 74AHCT123A SOT109-1 D E A X c y HE vMA Z 16 9 Q A2 A1 pin 1 index Lp 1 e bp 8 wM L detail X (A 3) A 0 2.5 scale 5 mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 0.069 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 10.0 9.8 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.050 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 0.039 0.016 Q 0.7 0.6 0.028 0.020 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.7 0.3 0.028 0.012 0.010 0.057 0.004 0.049 0.019 0.0100 0.39 0.014 0.0075 0.38 0.244 0.041 0.228 8 0o o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT109-1 REFERENCES IEC 076E07 JEDEC MS-012 EIAJ EUROPEAN PROJECTION ISSUE DATE 97-05-22 99-12-27 2000 Mar 15 20 Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset 74AHC123A; 74AHCT123A TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 D E A X c y HE vMA Z 16 9 Q A2 pin 1 index A1 Lp L (A 3) A 1 e bp 8 wM detail X 0 2.5 scale 5 mm DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.10 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.19 c 0.2 0.1 D (1) 5.1 4.9 E (2) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1.0 Lp 0.75 0.50 Q 0.4 0.3 v 0.2 w 0.13 y 0.1 Z (1) 0.40 0.06 8 0o o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT403-1 REFERENCES IEC JEDEC MO-153 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-04-04 99-12-27 2000 Mar 15 21 Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. Manual soldering 74AHC123A; 74AHCT123A If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. 2000 Mar 15 22 Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset Suitability of surface mount IC packages for wave and reflow soldering methods 74AHC123A; 74AHCT123A SOLDERING METHOD PACKAGE WAVE BGA, LFBGA, SQFP, TFBGA HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications. not suitable not not not suitable(2) recommended(3)(4) recommended(5) suitable suitable suitable suitable suitable suitable REFLOW(1) 2000 Mar 15 23 Philips Semiconductors - a worldwide company Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 68 9211, Fax. +359 2 68 9102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 800 943 0087 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V, Tel. +45 33 29 3333, Fax. +45 33 29 3905 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615 800, Fax. +358 9 6158 0920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 4099 6161, Fax. +33 1 4099 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 2353 60, Fax. +49 40 2353 6300 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI), Tel. +39 039 203 6838, Fax +39 039 203 6800 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW, Tel. +48 22 5710 000, Fax. +48 22 5710 001 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 58088 Newville 2114, Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SAO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 3341 299, Fax.+381 11 3342 553 For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 2000 Internet: http://www.semiconductors.philips.com SCA 69 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 613507/01/pp24 Date of release: 2000 Mar 15 Document order number: 9397 750 06696 |
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